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Welding Flux
Submerged Arc Welding Flux
100% Original Nc-559-Asm UV Tpf 100cc Flux Paste Solder Flux for SMD BGA Rework Reballing Lead Free The Best Tin Paste /Weld Flux /Tin Solder Paste
| US$500.00 - 800.00 | 100 kg (MOQ) |
Port:
Guangzhou, China
Production Capacity:
9999900 Kg / Month
Payment Terms:
L/C, T/T, Western Union, Paypal, Money Gram
Zhejiang, China
Last Login Date:
Jul 15, 2025
Business Type:
Manufacturer/Factory
Main Products:
Machine Parts, Engineering Machine Parts, Auto Parts, Home Decorative Products, Hydraulic Parts, Solar Air Conditioner, Wind Generator, Roller Blinds, Honeycomb Blinds, Vertical Blinds
Product Description
Company Info
Basic Info.
Model NO.
Solder paste series
state
Solid
pH
Neutral
Type
Resin
Melting Point
<200℃
Chemical Composition
SiO₂>30%
Function
Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow
Application
Submerged-arc Welding, Electroslag Welding
Manufacturing Method
Non-melting
Trademark
OEM / ODM
Transport Package
Plywood Pallet or Standard Carton Box
Origin
China
Product Description
100% Original NC-559-ASM UV TPF 100cc Flux Paste Solder Flux for SMD BGA Rework Reballing Lead free The Best Tin Paste /Weld Flux /Tin Solder Paste
PRODUCT INTRODUCTION:
Introduction:
Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc.
It's used in low ionic activator system, tin-run speed
Low level of smoke,surface insulation resistance value is high residue after curing
Therefore, the electrical properties of the cell phones and other communications products, very little interference
Features:
NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR
Recommended for BGA, CSP and other solder ball array repair and fill the ball
When using smoke less, no residue. Affordable.
Suitable for:
North and south bridge, cards, cell phone chip, video chip BGA solder, bumping
Also can use off the tin, the effect is very ideal
The residue was less bright spot, less smoke, no pungent odor, do not run the ball
Meet the needs of different solder
PRODUCT DETAILS:
PACKAGE & SHIPMENT:
PRODUCT INTRODUCTION:
Introduction:
Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc.
It's used in low ionic activator system, tin-run speed
Low level of smoke,surface insulation resistance value is high residue after curing
Therefore, the electrical properties of the cell phones and other communications products, very little interference
Features:
NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR
Recommended for BGA, CSP and other solder ball array repair and fill the ball
When using smoke less, no residue. Affordable.
Suitable for:
North and south bridge, cards, cell phone chip, video chip BGA solder, bumping
Also can use off the tin, the effect is very ideal
The residue was less bright spot, less smoke, no pungent odor, do not run the ball
Meet the needs of different solder
PRODUCT DETAILS:
PACKAGE & SHIPMENT:
Send your message to this supplier
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